Analysis of Pad Surface Roughness on Copper Chemical Mechanical Planarization
Matsumura, Yoshiyuki, Hirao, Takashi, Kinoshita, MasaharuVolume:
47
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/jjap.47.2083
Date:
April, 2008
File:
PDF, 415 KB
english, 2008