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Nanostructured TaN(O)/TaN Barrier Film Formed by Oxygen Plasma Treatment for Copper Interconnect
Ou, Keng-Liang, Lin, Ming-Hong, Chiou, Shi-YungVolume:
7
Year:
2004
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.1805512
File:
PDF, 1.23 MB
english, 2004