Diffusion Barriers Between Al and Cu for the Cu...

Electrochemical and Solid-State Letters 2008 Vol. 11; Iss. 5

Diffusion Barriers Between Al and Cu for the Cu Interconnect of Memory Devices

Kim, Soo-Hyun, Yim, Sung-Soo, Lee, Do-Joong, Kim, Ki-Su, Kim, Hyun-Mi, Kim, Ki-Bum, Sohn, Hyunchul
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
11
Year:
2008
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.2890092
File:
PDF, 665 KB
english, 2008
Conversion to is in progress
Conversion to is failed