Evaluation of Stability and Reactivity of Cu Electroless...

Journal of The Electrochemical Society 2011 Vol. 158; Iss. 9

Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-Situ Transmittance Measurement

Park, Kyung Ju, Koo, Hyo-Chol, Lim, Taeho, Kim, Myung Jun, Kwon, Oh Joong, Kim, Jae Jeong
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Volume:
158
Year:
2011
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3606532
File:
PDF, 1.23 MB
english, 2011
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