Efficient Heat Dissipation Design of High-Power Multi-Chip...

Advanced Materials Research 2012 / 2 Vol. 463-464

Efficient Heat Dissipation Design of High-Power Multi-Chip Cob Package Led Modules

Wu, Hsueh Han, Lin, Kuan Hong, Lin, Shun Tian
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Volume:
463-464
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.463-464.1332
Date:
February, 2012
File:
PDF, 827 KB
english, 2012
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