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Oxygen Influence on Wetting and Bonding between Copper and Aluminum Nitride
Joyeux, Thierry, Jarrige, Jean, Labbe, J.C., Lecompte, J.P., Alexandre, T.Volume:
206-213
Year:
2002
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.206-213.535
File:
PDF, 405 KB
2002