Improved Thermal Stability and Electrical Performance by...

ECS Solid State Letters 2012 / 08 Vol. 1; Iss. 3

Improved Thermal Stability and Electrical Performance by Using PEALD Ultrathin Al2O3 Film with Ta as Cu Diffusion Barrier on Low k Dielectrics

Ding, S.-F., Xie, Q., Chen, F., Lu, H.-S., Deng, S.-R., Deduytsche, D., Detavernier, C., Qu, X.-P.
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Volume:
1
Language:
english
Journal:
ECS Solid State Letters
DOI:
10.1149/2.006203ssl
Date:
August, 2012
File:
PDF, 538 KB
english, 2012
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