A Study of Warpage and its Mechanism in Sequential...

A Study of Warpage and its Mechanism in Sequential Overmolding

Tseng, S-C., Chang, K-J., Huang, C-T.
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Volume:
30
Language:
english
Journal:
Journal of Polymer Engineering
DOI:
10.1515/POLYENG.2010.30.3-4.189
Date:
January, 2010
File:
PDF, 2.81 MB
english, 2010
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