Packaging and thermal evaluation of thermally operated...

Microelectronics Journal 1999 Vol. 30; Iss. 11

Packaging and thermal evaluation of thermally operated intelligent micropump unit

A Morrissey, J Alderman, G Kelly, Zs Kohári, A Páhi, M Rencz
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Volume:
30
Year:
1999
Language:
english
Pages:
6
DOI:
10.1016/s0026-2692(99)00072-5
File:
PDF, 462 KB
english, 1999
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