Bonding strengths at plastic encapsulant–gold-plated copper...

Microelectronics Reliability 2000 Vol. 40; Iss. 7

Bonding strengths at plastic encapsulant–gold-plated copper leadframe interface

Sung Yi, Jang-Kyo Kim, Chee Yoon Yue, Jang-Hsing Hsieh
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Volume:
40
Year:
2000
Language:
english
Pages:
8
DOI:
10.1016/s0026-2714(00)00048-2
File:
PDF, 237 KB
english, 2000
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