New assembling technique for BGA packages without thermal processes
Valentin Videkov, Slavka Tzanova, Radosvet Arnaudov, Nikolai IordanovVolume:
41
Year:
2001
Language:
english
Pages:
5
DOI:
10.1016/s0026-2714(00)00257-2
File:
PDF, 223 KB
english, 2001