Wafer level packaging of a tape flip-chip chip scale...

Microelectronics Reliability 2001 Vol. 41; Iss. 5

Wafer level packaging of a tape flip-chip chip scale packages

Greg Hotchkiss, Gonzalo Amador, Darvin Edwards, Paul Hundt, Les Stark, Roger Stierman, Gail Heinen
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Volume:
41
Year:
2001
Language:
english
Pages:
9
DOI:
10.1016/s0026-2714(00)00261-4
File:
PDF, 592 KB
english, 2001
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