Three-Dimensional Voids Simulation in chip Metallization...

Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation

D. Dalleau, K. Weide-Zaage
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Volume:
41
Year:
2001
Pages:
6
DOI:
10.1016/s0026-2714(01)00151-2
File:
PDF, 495 KB
2001
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