Degradation mechanism of power devices under di/dt thermal...

Degradation mechanism of power devices under di/dt thermal shocks: turn-on of a TRIAC in Q3

S. Forster, T. Lequeu, R. Jérisian
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Volume:
43
Year:
2003
Language:
english
Pages:
10
DOI:
10.1016/s0026-2714(02)00261-5
File:
PDF, 869 KB
english, 2003
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