Impact of probing procedure on flip chip reliability

Impact of probing procedure on flip chip reliability

Kuo-Ming Chen, Kuo-Ning Chiang
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Volume:
43
Year:
2003
Language:
english
Pages:
8
DOI:
10.1016/s0026-2714(02)00267-6
File:
PDF, 609 KB
english, 2003
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