![](/img/cover-not-exists.png)
Impact of probing procedure on flip chip reliability
Kuo-Ming Chen, Kuo-Ning ChiangVolume:
43
Year:
2003
Language:
english
Pages:
8
DOI:
10.1016/s0026-2714(02)00267-6
File:
PDF, 609 KB
english, 2003