Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages
T.Y. Lin, K.L. Davison, W.S. Leong, Simon Chua, Y.F. Yao, J.S. Pan, J.W. Chai, K.C. Toh, W.C. TjiuVolume:
43
Year:
2003
Language:
english
Pages:
7
DOI:
10.1016/s0026-2714(03)00037-4
File:
PDF, 325 KB
english, 2003