Board level solder joint reliability modeling and testing...

Microelectronics Reliability 2003 Vol. 43; Iss. 7

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
43
Year:
2003
Language:
english
Pages:
7
DOI:
10.1016/s0026-2714(03)00127-6
File:
PDF, 283 KB
english, 2003
Conversion to is in progress
Conversion to is failed