Microanalysis and electromigration reliability performance...

Microelectronics Reliability 2003 Vol. 43; Iss. 7

Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects

Sherry Suat Cheng Khoo, Pee Ya Tan, Steven H. Voldman
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Volume:
43
Year:
2003
Language:
english
Pages:
7
DOI:
10.1016/s0026-2714(03)00133-1
File:
PDF, 224 KB
english, 2003
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