Sub-pixel image correlation: an alternative to SAM and dye...

Microelectronics Reliability 2004 Vol. 44; Iss. 2

Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages

Jason Y.L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten
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Volume:
44
Year:
2004
Language:
english
Pages:
9
DOI:
10.1016/s0026-2714(03)00162-8
File:
PDF, 943 KB
english, 2004
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