Comprehensive board-level solder joint reliability modeling...

Microelectronics Reliability 2003 Vol. 43; Iss. 8

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong
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Volume:
43
Year:
2003
Language:
english
Pages:
10
DOI:
10.1016/s0026-2714(03)00184-7
File:
PDF, 268 KB
english, 2003
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