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Materials characterization of the effect of mechanical bending on area array package interconnects
Daniel T Rooney, N Todd Castello, Mike Cibulsky, Doug Abbott, Dongji XieVolume:
44
Year:
2004
Language:
english
Pages:
11
DOI:
10.1016/s0026-2714(03)00193-8
File:
PDF, 1.00 MB
english, 2004