Investigation of delaminations during thermal stress:...

Microelectronics Reliability 2003 Vol. 43; Iss. 9-11

Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures

P. Rajamand, R. Tilgner, R. Schmidt, J. Baumann, P. Klofac, M. Rothenfusser
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Volume:
43
Year:
2003
Pages:
6
DOI:
10.1016/s0026-2714(03)00309-3
File:
PDF, 1.41 MB
2003
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