Reliability study on three-dimensional AuWSiN...

Microelectronics Reliability 1997 Vol. 37; Iss. 10-11

Reliability study on three-dimensional AuWSiN interconnections for ultra-compact MMICs

Hirohiko Sugahara, Masakatsu Kimizuka, Yoshino K. Fukai, Makoto Hirano, Fumiaki Hyuga
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Volume:
37
Year:
1997
Language:
english
Pages:
4
DOI:
10.1016/s0026-2714(97)00133-9
File:
PDF, 265 KB
english, 1997
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