Substrate-to-base solder joint reliability in high power IGBT modules
E. Herr, T. Frey, R. Schlegel, A. Stuck, R. ZehringerVolume:
37
Year:
1997
Language:
english
Pages:
4
DOI:
10.1016/s0026-2714(97)00147-9
File:
PDF, 280 KB
english, 1997