Quality conformance and qualification of microelectronic packages and interconnects
Michael Pecht, Abhijit Dasgupta, John W. Evans, Jillian Y. Evans, M.M. JevtićVolume:
37
Year:
1997
Language:
english
Pages:
2
DOI:
10.1016/s0026-2714(97)83454-3
File:
PDF, 190 KB
english, 1997