The use of impedance spectroscopy, SEM and SAM imaging for...

Microelectronics Reliability 1998 Vol. 38; Iss. 10

The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies

Y. Ousten, S. Mejdi, A. Fenech, J.Y. Deletage, L. Bechou, M.G. Perichaud, Y. Danto
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Volume:
38
Year:
1998
Language:
english
Pages:
7
DOI:
10.1016/s0026-2714(98)00060-2
File:
PDF, 348 KB
english, 1998
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