A step forward in the transient thermal characterization of...

A step forward in the transient thermal characterization of chips and packages

V. Szkely, M. Rencz, B. Courtois
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Volume:
39
Year:
1999
Language:
english
Pages:
8
DOI:
10.1016/s0026-2714(98)00198-x
File:
PDF, 711 KB
english, 1999
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