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1f Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment
L.K.J. Vandamme, M.G. Perichaud, E. Noguera, Y. Danto, U. BehnerVolume:
39
Year:
1999
Language:
english
Pages:
6
DOI:
10.1016/s0026-2714(99)00154-7
File:
PDF, 387 KB
english, 1999