Localization of defects in die-attach assembly by...

Microelectronics Reliability 1999 Vol. 39; Iss. 6-7

Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy

L. Bechou, L. Angrisiani, Y. Ousten, D. Dallet, H. Levi, P. Daponte, Y. Danto
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Volume:
39
Year:
1999
Language:
english
Pages:
7
DOI:
10.1016/s0026-2714(99)00155-9
File:
PDF, 564 KB
english, 1999
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