A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS:...

Machining Science and Technology 2006 / 07 Vol. 10; Iss. 2

A GRINDING-BASED MANUFACTURING METHOD FOR SILICON WAFERS: GENERATION MECHANISMS OF CENTRAL BUMPS ON GROUND WAFERS

Sun, Wangping, Pei, Z. J., Fisher, Graham R.
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Volume:
10
Language:
english
Journal:
Machining Science and Technology
DOI:
10.1080/10910340600710089
Date:
July, 2006
File:
PDF, 591 KB
english, 2006
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