![](/img/cover-not-exists.png)
Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization
Xiao, Shuo, Zhao, Yang, Cao, Yuan, Jiang, Haifeng, Zhu, WenliangVolume:
41
Language:
english
Journal:
Circuit World
DOI:
10.1108/CW-10-2014-0043
Date:
February, 2015
File:
PDF, 369 KB
english, 2015