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Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
Choi, Sang-Kyung, Kim, Hangil, Kim, Junbeam, Cheon, Taehoon, Seo, Jong Hyun, Kim, Soo-HyunLanguage:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2015.05.033
Date:
May, 2015
File:
PDF, 1.65 MB
english, 2015