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Surface-Tension-Driven Self-Assembly of 3-D Microcomponents by Using Laser Reflow Soldering and Wire Limiting Mechanisms
Yang, Lei, Liu, Wei, Wang, Chunqing, Tian, YanhongVolume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2012.2221126
Date:
January, 2013
File:
PDF, 3.10 MB
english, 2013