Surface-Tension-Driven Self-Assembly of 3-D Microcomponents...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 01 Vol. 3; Iss. 1

Surface-Tension-Driven Self-Assembly of 3-D Microcomponents by Using Laser Reflow Soldering and Wire Limiting Mechanisms

Yang, Lei, Liu, Wei, Wang, Chunqing, Tian, Yanhong
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2012.2221126
Date:
January, 2013
File:
PDF, 3.10 MB
english, 2013
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