Simulation of shape and temperature field evolution of...

Simulation of shape and temperature field evolution of solder joints during reflow solidification process

Chang, H. J., Hwang, W. S.
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Volume:
22
Language:
english
Journal:
International Journal of Cast Metals Research
DOI:
10.1179/136404609X367281
Date:
August, 2009
File:
PDF, 742 KB
english, 2009
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