The study of deformation and stress–strain distribution of...

ARCHIVE Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science 1989-1996 (vols 2008 / 6 Vol. 222; Iss. 6

The study of deformation and stress–strain distribution of nano-scale thin sheet copper under the biaxial tensile loads by using molecular dynamics and finite-element method

Lin, Z-C, Huang, J-C, Chao, Y-C
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Volume:
222
Language:
english
Journal:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
DOI:
10.1243/09544062JMES528
Date:
June, 2008
File:
PDF, 939 KB
english, 2008
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