Thermally Stable TiVCrZrHf Nitride Films as Diffusion...

Electrochemical and Solid-State Letters 2012 Vol. 15; Iss. 1

Thermally Stable TiVCrZrHf Nitride Films as Diffusion Barriers in Copper Metallization

Liang, Shih-Chang, Tsai, Du-Cheng, Chang, Zue-Chin, Lin, Tai-Nan, Shiao, Ming-Hua, Shieu, Fuh-Sheng
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Volume:
15
Year:
2012
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/2.012201esl
File:
PDF, 175 KB
english, 2012
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