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[IEEE 2006 IEEE Nanotechnology Materials and Devices Conference - Gyeongju, South Korea (2006.10.22-2006.10.25)] 2006 IEEE Nanotechnology Materials and Devices Conference - The reliability of MLCC by the additives associated with the grain size and sintering condition
Hyun Duk Kim,, Eung Kwon Kim,, Tae Yong Lee,, Bong Suk Kim,, Byong Chul Woo,, Joon Tae Song,Year:
2006
Language:
english
DOI:
10.1109/NMDC.2006.4388825
File:
PDF, 352 KB
english, 2006