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SPIE Proceedings [SPIE Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 - Cannes-Mandelieu, France (Tuesday 19 March 2002)] Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 - Reliability of packaged MEMS in shock environment: crack and striction modeling
Millet, Olivier, Collard, Dominique, Buchaillot, Lionel, Courtois, Bernard, Karam, Jean Michel, Markus, Karen W., Michel, Bernd, Mukherjee, Tamal, Walker, James A.Volume:
4755
Year:
2002
Language:
english
DOI:
10.1117/12.462874
File:
PDF, 336 KB
english, 2002