PDN Impedance Modeling for Multiple Through Vias Array in...

IEEE Transactions on Electromagnetic Compatibility 2014 / 10 Vol. 56; Iss. 5

PDN Impedance Modeling for Multiple Through Vias Array in Doped Silicon

Luo, Guang-Xiao, Li, Er-Ping, Wei, Xing-Chang, Cui, Xiang, Hao, Ran
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Volume:
56
Language:
english
Journal:
IEEE Transactions on Electromagnetic Compatibility
DOI:
10.1109/TEMC.2014.2312356
Date:
October, 2014
File:
PDF, 1.28 MB
english, 2014
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