Development of a tight-binding model for Cu and its...

Journal of Materials Science 2015 / 9 Vol. 50; Iss. 17

Development of a tight-binding model for Cu and its application to a Cu-heat-sink under irradiation

Ding, Wenyi, He, Haiyan, Pan, Bicai
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Volume:
50
Language:
english
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-015-9097-7
Date:
September, 2015
File:
PDF, 1013 KB
english, 2015
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