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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Structure reliability and characterization for FC package w/Embedded Trace coreless Substrate
Chen, Eason, Lan, Albert, You, Jack, Liao, MarkYear:
2014
Language:
english
DOI:
10.1109/EPTC.2014.7028314
File:
PDF, 196 KB
english, 2014