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Effect of Impurity Distribution on Corrosion Behavior of Electrodeposited Copper in H[sub 2]O[sub 2]-Based Slurry
Lin, Jeng-Yu, Wan, Chi-Chao, Wang, Yung-Yun, Chen, Jui-Chin, Lai, Jiun-Yu, Fan, Yuh-Da, Chuang, Jui-PingVolume:
154
Year:
2007
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2722562
File:
PDF, 622 KB
english, 2007