(Invited) Development of Novel Three-Dimensional...

ECS Transactions 2014 / 03 Vol. 61; Iss. 6

(Invited) Development of Novel Three-Dimensional Structuring of Integrated Circuits by Using Low Temperature Direct Bonding for CMOS Image Sensors

Goto, M., Hagiwara, K., Iguchi, Y., Ohtake, H., Saraya, T., Higurashi, E., Toshiyoshi, H., Hiramoto, T.
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Volume:
61
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/06106.0087ecst
Date:
March, 2014
File:
PDF, 580 KB
english, 2014
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