Multiscale perspectives of interface delamination in...

Molecular Simulation 2011 / 07 Vol. 37; Iss. 8

Multiscale perspectives of interface delamination in microelectronic packaging applications

Iwamoto, Nancy, Hölck, Ole, Noijen, Sander
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Volume:
37
Language:
english
Journal:
Molecular Simulation
DOI:
10.1080/08927022.2011.551882
Date:
July, 2011
File:
PDF, 373 KB
english, 2011
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