Hierarchical Test Integration Methodology for 3-D ICs

IEEE Design and Test 2015 / 8 Vol. 32; Iss. 4

Hierarchical Test Integration Methodology for 3-D ICs

Chou, Che-Wei, Li, Jin-Fu, Yu, Yun-Chao, Lo, Chih-Yen, Kwai, Ding-Ming, Chou, Yung-Fa
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
32
Language:
english
Journal:
IEEE Design & Test
DOI:
10.1109/MDAT.2015.2427257
Date:
August, 2015
File:
PDF, 665 KB
english, 2015
Conversion to is in progress
Conversion to is failed