A novel multi-level interconnect scheme with air as low K inter-metal dielectric for ultradeep submicron application
Chung-Hui Chen, Yean-Kuen Fang, Chun-Sheng Lin, Chih-Wei Yang, Jang-Cheng HsiehVolume:
45
Year:
2001
Language:
english
Pages:
5
DOI:
10.1016/s0038-1101(00)00192-1
File:
PDF, 510 KB
english, 2001