Thermal reliability and characterization of InGaP Schottky...

Solid-State Electronics 1997 Vol. 41; Iss. 1

Thermal reliability and characterization of InGaP Schottky contact with Ti/Pt/Au metals

Ching-Ting Lee, Hung-Pin Shiao, Nien-Tze Yeh, Chang-Da Tsai, Yen-Tang Lyu, Yuan-Kuang Tu
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
41
Year:
1997
Language:
english
Pages:
5
DOI:
10.1016/s0038-1101(96)00136-0
File:
PDF, 329 KB
english, 1997
Conversion to is in progress
Conversion to is failed