[Engineering Materials and Processes] PCM-Enhanced Building...

  • Main
  • [Engineering Materials and Processes]...

[Engineering Materials and Processes] PCM-Enhanced Building Components || Overview of Basic Solid–Liquid PCMs Used in Building Envelopes—Packaging Methods, Encapsulation, and Thermal Enhancement

Kośny, Jan
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
10.1007/97
Year:
2015
Language:
english
DOI:
10.1007/978-3-319-14286-9_3
File:
PDF, 722 KB
english, 2015
Conversion to is in progress
Conversion to is failed