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[Engineering Materials and Processes] PCM-Enhanced Building Components || Overview of Basic Solid–Liquid PCMs Used in Building Envelopes—Packaging Methods, Encapsulation, and Thermal Enhancement
Kośny, JanVolume:
10.1007/97
Year:
2015
Language:
english
DOI:
10.1007/978-3-319-14286-9_3
File:
PDF, 722 KB
english, 2015