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Micro-ultrasonic powder moulding of Sn–Bi/Cu composite micro parts in semisolid form
Luo, Wen-yan, Wu, Xiao-yu, Wu, Shi-yun, Xu, Bin, Cheng, Rong, Ruan, Shuang-chenVolume:
223
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2015.04.020
Date:
September, 2015
File:
PDF, 1.60 MB
english, 2015