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Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness
Sharma, Tanu, Brüning, Ralf, Nguyen, Tang Cam Lai, Bernhard, Tobias, Brüning, FrankVolume:
140
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2015.05.003
Date:
June, 2015
File:
PDF, 1.52 MB
english, 2015